Flomerics has introduced Version 5 of its web-based Flopack software providing the ability to create Delphi compact models that predict the performance of electronic components under soon-to-be-published thermal testing standards from JEDEC committee JC-15.1. Flopack produces behavioural compact models that can predict the temperature of electronic component packages at critical points such as the junction, case and board, in far less time than would be required using conventional detailed package models. Version 5 also provides a number of new features including a faster, more accurate non-linear optimiser, support for additional nodes, user access to set-up parameters and the ability to create compact models from non-Flomerics simulation data. Flopack consists of a collection of “Smart Part” modules installed on a central web server.